HEULE to Exhibit at IMTS 2018 in Booth #431352

Posted on: August 21, 2018
Tags: IMTS2018, Cross Hole Deburring, X-Bores

Once again, HEULE Precision Tools will be joining thousands of exhibitors in the manufacturing industry for the biennial International Manufacturing Technology Show (IMTS) in Chicago, IL. 


Included in our featured tools that are helping manufacturers improve their processes are five of our best-selling "Proven Solutions". These tools have been proven to help solve challenges to cut production costs and produce higher quality parts off the machine, thereby helping manufacturers to reach peak production. 

Among our "Proven Solutions" that will be on display at the show are COFA for cross hole deburring, SNAP for micro deburring, DEFA for precision chamfering, BSF for back spotfacing, and VEX-S for combination drilling/chamfering. 

Cross hole deburring tool COFA-X

Also on display in Booth #431352 will be HEULE's newest tool solution for complex cross hole deburring applications: COFA-X. COFA-X is part of HEULE's "X-BORES" line of tooling for cross hole deburring and is designed for 1:1 ratio cross holes on extreme uneven surfaces. It is the first and only tooling system to consistently and reliably remove burrs from interior uneven bore edges in applications with intersecting holes. 

Tested for effectiveness on different types of applications, COFA-X is a customized tool designed to help manufacturers automate processes and speed up production times in high-volume situations. It can be used for bore diameters of 4 mm or larger. Using COFA-X, manual deburring can be eliminated, thus reducing cycle times and labor costs. 

For more information about the COFA-X tool, you can visit the product page on our website here. Also, you can download a copy of the COFA-X brochure here.  If you are attending IMTS, please make sure to stop by our booth #431352 and see the COFA-X tool in person. Our technical engineers can take a look at your specific application to see if it is a good fit for this new tool solution.